JPH01104039U - - Google Patents
Info
- Publication number
- JPH01104039U JPH01104039U JP19758287U JP19758287U JPH01104039U JP H01104039 U JPH01104039 U JP H01104039U JP 19758287 U JP19758287 U JP 19758287U JP 19758287 U JP19758287 U JP 19758287U JP H01104039 U JPH01104039 U JP H01104039U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor
- resin molded
- heat
- protective cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000010292 electrical insulation Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19758287U JPH0356055Y2 (en]) | 1987-12-28 | 1987-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19758287U JPH0356055Y2 (en]) | 1987-12-28 | 1987-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01104039U true JPH01104039U (en]) | 1989-07-13 |
| JPH0356055Y2 JPH0356055Y2 (en]) | 1991-12-16 |
Family
ID=31488128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19758287U Expired JPH0356055Y2 (en]) | 1987-12-28 | 1987-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356055Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008028311A (ja) * | 2006-07-25 | 2008-02-07 | Mitsubishi Electric Corp | 半導体装置 |
-
1987
- 1987-12-28 JP JP19758287U patent/JPH0356055Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008028311A (ja) * | 2006-07-25 | 2008-02-07 | Mitsubishi Electric Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0356055Y2 (en]) | 1991-12-16 |
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